HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology. At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology. We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another. Our growing team is looking for a OSAT Operation Engineer to manage our backend operation at our manufacturing partner sites. The candidate will be working closely with our manufacturing partners to scale up and maintain robust and scalable backend operations across different platforms and manufacturing partners As part of your responsibilities, you will be: Serve as the primary on-site interface between HyperLight and external manufacturing partners, including foundries test team and test OSAT vendors, to ensure seamless production execution. Work closely with external manufacturing partners and equipment vendors to debug any test-related issues (both hardware and software) encountered to minimize downtime and disruption to production Own and drive wafer-level backend execution across foundry and OSAT partners—including wafer-level dicing/singulation, bumping, and assembly—covering prioritization, scheduling, vendor readiness, and day-to-day execution to meet production timelines and delivery commitments. Ensure the integrity, accuracy, and organization of data received from foundries and OSATs, enabling effective analysis and decision-making. Collaborate with cross-functional teams (test engineering, process engineering, operations, and quality) to troubleshoot backend process yield, test-related issues. Coordinate with internal stakeholders and external partners to identify root causes and drive timely resolution of yield excursions and test anomalies. Oversee the implementation of corrective actions at both foundry test and OSAT sites and monitor the effectiveness of solutions through yield and test metrics tracking. Drive continuous improvement initiatives for production workflows, focusing on efficiency, quality, and cycle time reduction. Partner with operations teams to optimize wafer flow from foundry to OSAT, ensuring smooth logistics and minimal delays. Work closely with test engineering teams to reduce production test time while maintaining coverage and product quality. Develop and maintain clear communication and reporting on production status, issues, and improvement initiatives with internal and external stakeholders. Requirements Bachelor’s or master’s degree in Electrical engineering, Electronics Engineering, Materials Science, Photonics, or a related technical discipline. Minimum 5 years of experience in semiconductor test, product engineering, or manufacturing operations, with direct engagement with foundries and OSAT partners. Deep expertise in semiconductor backend (post-fab) manufacturing —with strong, hands-on understanding of wafer-level dicing, bumping, and assembly —including: Wafer sort / probe (wafer test) Wafer-level dicing/singulation : street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling. Wafer bumping (e.g., Cu pillar / solder bump): process flow understanding (UBM/metallization, plating, reflow), bump metrology, reliability risks, and supplier control plans. Die/chiplet assembly and packaging : die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness. Proven track record managing OSAT operations end-to-end, including production scheduling, execution, yield tracking, and vendor performance management. Strong experience in yield engineering and data-driven problem solving, with demonstrated ability to lead root cause analysis and drive corrective actions to closure across external partners. Hands-on expertise in optical testing, including characterization, validation, and troubleshooting of photonic or optical devices is a plus Advanced analytical skills with strong proficiency in Python for data analysis, automation, and yield modelling. Solid experience with LabVIEW for test automation, instrumentation control, and data acquisition in production or R&D environments. Strong understanding of cost-of-test drivers and test optimization, with demonstrated impact on test time reduction and production efficiency. Experience leading cross-functional initiatives across test engineering, process, operations, and external vendors, with the ability to influence without direct authority. Excellent communication and stakeholder management skills, with experience presenting data, issues, and recommendations to both technical and executive audiences. Self-directed, results-oriented, and comfortable operating