Boston Materials develops advanced Liquid Metal ZRT® thermal interface materials that improve heat dissipation for AI and high-performance computing chips.
Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon. For more information, visit https://www.bomaterials.com/ THE OPPORTUNITY A career-defining opportunity rarely offers all of the following: Direct connection to the mission. Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact. Growth beyond a single role. At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization. Work on problems that matter. Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries. Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us. The Role We are seeking a highly motivated Field Applications Engineer to serve as the primary technical partner for our customers in Taiwan as they evaluate and adopt our high-performance thermal interface material (TIM) products. The role is based in Taipei, Taiwan-remote with frequent on-site customer visits. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, OSATs, and foundries to influence the adoption of cutting-edge thermal solutions in next-generation AI and HPC silicon and data center systems. Join us to solve one of the most critical challenges facing AI Infrastructure and High Performance Computing – thermal management!