AttoTude is a Menlo Park–based company developing ASIC over Dielectric interconnect technology for high-bandwidth, energy-efficient AI and hyperscale infrastructure connectivity.
<p></p> <div><strong><span data-olk-copy-source="MessageBody">Role Description</span></strong></div> <div>This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.</div> <div> </div> <div><strong>Qualifications</strong></div> <ul> <li> <div>Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.</div> <div> <div>Mechanical, thermal and FEA modeling and design experience.</div> </div> </li> <li> <div>Proven track-record of product development, from concept through volume production. </div> </li> <li> <div>Ability to work effectively in cross-disciplinary teams and drive technical collaborations.</div> </li> <li>Excellent analytical and problem-solving skills.</li> <li>Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.</li> </ul> <p></p> <p> </p>