Mechanical Design Engineer

About the company

Oxford Quantum Circuits is a spinout from Oxford University that develops superconducting quantum computers and offers access to them via cloud-deployed data-centre services.

About this role

Mechanical Design Engineer At OQC, we aren’t just theorising about the future; we’re building it. Born from a philosophy of bold innovation, we’ve transitioned quantum computing from an academic ambition into a commercial reality—and we’re just getting started. The Purpose Increase OQC’s mechanical design and simulation capability by delivering high-quality, manufacturable components and complex sub-assemblies for our quantum systems. As a Mechanical Design Engineer, you’ll own mechanical design packages from initial requirements and concept development through to CAD, structural and thermal analysis, production drawings and release through our product lifecycle management systems. The Role Working within Engineering Operations and reporting to the Head of Design Engineering, you’ll take responsibility for designing high-precision components and assemblies that meet demanding technical, manufacturing and integration requirements. You’ll collaborate with subject-matter experts across OQC to understand requirements, resolve multidisciplinary design challenges and convert engineering concepts into manufacture-ready solutions. You’ll also work directly with external suppliers and manufacturers, using production feedback to improve designs and resolve questions relating to drawings, tolerances and manufacturability. This is a hands-on engineering role that includes work within laboratory, preparation-room and workshop environments during design verification, integration and initial build activities. What You’ll Be Working On Own the mechanical design of high-precision components and complex sub-assemblies, developing solutions from defined requirements through to manufacture-ready release. Produce complete mechanical design packages, including detailed 3D CAD models within SolidWorks PDM, bills of materials, assembly methods and manufacturing drawings. Perform structural and thermal analysis using Ansys Mechanical or equivalent tools, covering thermal modelling, heat transfer, stress and fatigue for both room-temperature and cryogenic environments. Apply design-for-manufacture principles and appropriate geometric dimensioning and tolerancing to communicate design intent and ensure components can be produced reliably and efficiently. Resolve mechanical integration, interface and packaging clashes across components and assemblies, working with relevant technical specialists where cross-disciplinary decisions are required. Work with suppliers and manufacturers to resolve drawing, tolerance and production queries, while applying relevant mechanical design principles associated with EMC, CE and FCC requirements for equipment enclosures. Support initial fit and build activities, identify design issues requiring resolution and share technical knowledge, lessons learned and effective design approaches across the wider engineering team. What We’re Looking For A degree in Mechanical Engineering or a related engineering discipline. Experience leading the design-to-manufacture process for high-precision components and assemblies. Strong 3D CAD and production-drawing capability, using SolidWorks or a comparable mechanical design platform. Experience conducting structural and thermal finite-element analysis to guide design decisions, using Ansys Mechanical or similar simulation software. Experience taking designs beyond the digital environment and supporting physical builds, integration or design verification. A practical understanding of design-for-manufacture principles and the factors that influence component quality, tolerances, cost and production feasibility. Experience resolving technical, drawing and manufacturing questions directly with suppliers. Strong technical-documentation, work-planning and delivery skills. Clear stakeholder communication and the ability to work effectively with subject-matter experts from different engineering disciplines. A problem-solving mindset, supported by strong planning, adaptability and close attention to detail. The ‘Nice-to-Haves’ Experience designing hardware for cryogenic, vacuum, aerospace or other high-precision environments. Experience designing equipment enclosures with consideration for EMC, CE or FCC requirements. Experience supporting integration activities, fit checks and initial hardware builds. Familiarity with product lifecycle management, product data management and bill-of-materials management. Experience with cryogenic mechanical design. Practical knowledge of geometric dimensioning and tolerancing and failure mode and effects analysis. Why Join OQC You’ll join an Engineering Operations team supporting the development of highly complex quantum systems, with the opportunity to take genuine ownership of mechanical designs from early requirements through to manufacture and initial build. This role offers the chance to solve demanding structural, thermal and integration challenges across both room-temperature and cryogenic environments. You’ll work closely with specialist engineers, advanced simulation tools and manufacturing partners, seeing your designs progress from CAD models and analysis into physical hardware used within OQC’s quantum technology.