Computational Electromagnetics Engineer – Signal Integrity

About the company

Vinci develops AI-powered simulation software that dramatically accelerates chip and other hardware design workflows.

About this role

About Us At Vinci4D, we are building the next generation of multi-physics simulation software for semiconductor and electronics applications — tools that let engineers model thermal, fluid, electromagnetic, and structural phenomena in the same framework, from first principles to final answer. We are a small, technically deep team that moves fast, ships real software, and takes on problems that the established players have not solved well. If you want your work to be foundational to a platform that changes how the electronics industry designs its most demanding products, this is the place. The Role We are looking for a computational electromagnetics engineer with deep expertise in signal integrity simulation for the semiconductor and electronics industry. You understand Maxwell's equations well enough to derive discretisations from scratch, and you have shipped production EM solvers or SI analysis tools that real engineers have relied on to qualify packages, characterise high-speed channels, or sign off interfaces at multi-gigabit data rates. You will design and implement EM solver capabilities within Vinci4D's multi-physics platform — spanning signal integrity analysis, frequency-domain and time-domain full-wave methods, and quasi-static extraction. You will bring the domain depth needed to make those tools genuinely useful for signal integrity, power integrity, and EM-thermal coupling workflows in semiconductor packaging and PCB design. This is not a "run simulations for customers" role. You will be building the solvers themselves: formulating the problems mathematically, implementing the discretisations, validating against reference solutions, and integrating the results into a coupled multi-physics framework. What You Will Work On - Design and implement frequency-domain and time-domain full-wave EM solvers targeting IC package, via, connector, and PCB interconnect structures at GHz frequencies - Develop S-parameter port extraction workflows — implementing waveport and lumped port excitations, Fourier-transforming time-domain responses, and producing touchstone-format output compatible with industry channel simulators - Build signal integrity analysis capabilities: transmission line characterisation, via resonance prediction, crosstalk analysis, and eye diagram generation from simulated channel responses - Implement time-domain methods (FDTD) with PML absorbing boundary conditions for broadband signal integrity and EMI analysis, including Gaussian pulse excitation and wideband S-parameter extraction in a single simulation run - Develop quasi-static field solvers for parasitic extraction — resistive, capacitive, and inductive — with frequency-dependent skin-effect corrections, producing RLGC outputs for SPICE and channel simulation workflows - Build the EM-to-thermal coupling layer: computing volumetric Ohmic dissipation from EM field solutions and passing it as a source term to Vinci4D's thermal solver, with support for iterative coupling under temperature-dependent material properties - Develop and maintain validation infrastructure: convergence tests, golden-output comparisons against commercial reference tools (HFSS, CST, SIwave), and SI-specific benchmarks covering via S-parameters, transmission line impedance, and crosstalk - Collaborate with the team to integrate EM capabilities into the Vinci app, delivering outputs in formats familiar to SI engineers: S-parameters, eye diagrams, impedance profiles, and RLGC matrices What We Are Looking For TECHNICAL SKILLS — MUST HAVE - Deep working knowledge of computational electromagnetics: FDTD, FDFD, and quasi-static methods, with a clear understanding of when each is appropriate and what their failure modes are - Hands-on experience with signal integrity simulation for the semiconductor industry — high-speed channel analysis, package and via characterisation, transmission line extraction, crosstalk, or PDN impedance — with an understanding of the numerics behind the tools, not just their outputs - Solid understanding of the full SI simulation workflow: from 3D EM field solutions through S-parameter extraction, through channel simulation, to eye diagram and margin analysis - Experience implementing FDTD solvers including the Yee cell staggered update, CFL stability, PML or absorbing boundary conditions, and port-based S-parameter extraction via Fourier analysis of time-domain responses - Experience with frequency-domain EM (FDFD or equivalent) including complex material properties, frequency sweeps, and direct or iterative solution of the resulting sparse complex linear systems - Experience with quasi-static field solvers for resistive, capacitive, and inductive parasitic extraction, including frequency-dependent skin-effect modelling - Proficiency in C++ and/or Python in a performance-critical scientific computing context - Strong software engineering practices: Git, code review, automated testing, CI/CD pipelines, and regression testing against reference solutions TECHNICAL SKILLS — DESIRED - Working knowledge of high-speed interface standards relevant to semiconductor packaging: PCIe, DDR5/6, HBM, LPDDR, or equivalent SerDes interfaces at data rates above 10 Gbps - Experience with S-parameter characterisation and touchstone file workflows — generating, validating, and consuming multi-port S-parameter models in a production SI context - Solid understanding of the scale hierarchy in SI simulation: what quasi-static extraction covers, where full-wave treatment is required, and how the two are combined in a complete channel model - Familiarity with the EM-thermal coupling path in high-speed packaging or power electronics: deriving Ohmic heating from EM field solutions and using it as a thermal source term EXPERIENCE - 4–8 years of industry or research experience in computational electromagnetics applied to semiconductor packaging, PCB design, or high-speed electronics - Experien